SHENZHEN, China– (BUSINESS WIRE) – Fibocom (Stock Code: 300638), een toonaangevende wereldwijde leverancier van IoT (Internet of Things) draadloze oplossingen en draadloze communicatiemodules, brengt zijn nieuwste 5G LGA-module FG360 uit tijdens het CES 2021-evenement. De module is gebaseerd op het MediaTek-chipsetplatform en zal beschikbaar zijn in twee versies. FG360-EAU zal worden gelanceerd voor EMEA/APAC-markten en FG360-NA zal worden gelanceerd voor de Noord-Amerikaanse markt.

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FG360 is een 5G-module met hoge integratie, hoge gegevenssnelheid en uitstekende kostprestaties. Het is ontworpen op basis van het T750-chipsetplatform van MediaTek, dat een compact 7nm-ontwerp heeft met een 5G NR FR1-modem, een quad-core Arm Cortex-A55-processor en rijke essentiële randapparatuur, allemaal geïntegreerd op een enkele chipset. Door een hoge mate van integratie stelt de FG360-module klanten in staat om hun producten te ontwerpen met de beste prestaties en de meest optimale kosten.

Fibocom to Be The First in Providing Engineering Samples of 5G Module Based on MediaTek Chipset Platform

SHENZHEN, China–(BUSINESS WIRE)– Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions. FG360-EAU will be launched for EMEA/APAC markets, and FG360-NA will be launched for the North American market.

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Fibocom releases its latest 5G module FG360 during the CES 2021 event. The module supports 5G Sub-6GHz 2CC Carrier Aggregation 200MHz frequency and 5G + WiFi-6 connectivity to provide a high-speed and low-latency 5G network experience. Engineering samples of the module will be available in January. Fibocom will be the first in the industry to provide engineering samples of 5G modules based on the MediaTek chipset platform. (Photo: Business Wire)

FG360 is a 5G module with high integration, high data rate and great cost performance. It is designed based on MediaTek’s T750 chipset platform which adopts a 7nm compact design with a 5G NR FR1 modem, a quad-core Arm Cortex-A55 processor and rich essential peripherals all integrated on a single chipset. Through a high degree of integration, the FG360 module enables customers to design their products with the best performance and the most optimal cost.

FG360 supports 5G Sub-6GHz 2CC Carrier Aggregation 200MHz frequency to improve the utilization of spectrum resources and ensure an extended 5G coverage. FG360 can support SA peak rate downlink up to 4.67Gbps and uplink up to 1.25Gbps, enhancing the 5G wireless experience of customers. FG360 can also support multiple WIFI connections such as 5G 4×4，2.4G 4×4，and 5G 2×2+2.4G 2×2 dual-band Wi-Fi 6, allowing smart end devices to enjoy the full benefits of high-speed 5G + WIFI 6 connectivity.

FG360 has faster transmission speed, better carrying capacity, and lower network latency. It supports both 5G SA and NSA network architectures and compatible with 5G NR, LTE and WCDMA standards, eliminating customers’ investment concerns at the initial stage of 5G construction and responding to the commercial demand for rapid landing. FG360 comes with a rich set of interfaces including USB3.1, PCIe3.0, SPI, SDIO, GPIO, UART, etc., and two 2.5Gbps SGMII interfaces to allow for a variety of LAN configurations.

The highly integrated 5G module FG360 aims to empower the next generation of 5G connectivity. It offers a perfect solution for operators to achieve wide service coverage in a short time frame and offer fiber-like fixed wireless access (FWA) services through 5G CPE, gateways and routers. Empowered by the FG360 module, 5G FWA services will be able to bring a more affordable broadband alternative to areas with limited DSL, cable or fiber services and help consumers and businesses in less developed areas to access the high-speed wireless networks.

Engineering samples of FG360 will be available in January 2021 and massive production of the product is expected in Q3 2021. Fibocom will be the first in the industry to provide engineering samples of 5G modules based on the MediaTek chipset platform.

About Fibocom

Founded in 1999, Fibocom is a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules. We are committed to bringing reliable, accessible, secure, and intelligent wireless solutions to every IoT application scenario for the increasingly digitalized industries and enriched smart life of the whole society. In 2017, Fibocom become the first stock-listed (Stock Code: 300638) wireless module provider in China.

We provide technically advanced and high-performance 5G, 4G, NB-IoT/eMTC, 3G, and 2G, smart, auto-grade, GNSS, Wi-Fi/BT wireless modules. By technically embedding Fibocom’s wireless solutions into IoT devices that will become smart and remotely manageable with stable data transmission between devices and operation center, we empower the intelligent future of all industries that mainly include smart retail, ACPC (Always Connected PC), industry 4.0, smart grid, smart homes, smart agriculture, smart cities, telemedicine, metering, smart security surveillance, and the intelligently connected cars, etc. We have many long-term industry customers including Fortune Global 500 enterprises, which is an important driven power of our fast development.

Fibocom is headquartered in Shenzhen, China, and has R&D centers in both Shenzhen and Xi’an. We are globally located with more than 30 subsidiaries and regional operation centers in China, Americas, EMEA, and Asia Pacific Regions. Currently, we have more than 1000 global employees, and provide products and services in more than 100 countries and regions.

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Contacts

Media
Delia Zhu

market@fibocom.com
+86 755-26733555

www.fibocom.com